Keysight unveils new solder-in probe designed to access small geometry, high-density target devices
The size of electronic devices continues to shrink, resulting in smaller pads and narrower pitch spacing. Customers are actively seeking high density, small geometry solutions for probing modern electronic technologies to analyze and measure signals without interference.
Solder-in probe optimized for modern high-speed devices
Keysight has unveiled what it claims as the smallest solder-in probe head optimized for modern high-speed devices. The new MX0100A InfiniiMax microprobe is designed for use with the company’s InfiniiMax I/II probe amplifiers to access small geometry target devices.
The lead wires can be adjusted to accommodate targets from 0 mm to 7 mm apart, keeping in view the miniaturization of electronic devices.
Keysight claimed this microprobe is less than half the size of existing solder-in probe heads for high density, fine pitch devices.
When used in conjunction with Keysight’s 1169B 12 GHz InfiniiMax II probe amplifier, the MX0100A delivers up to full 12 GHz bandwidth.
The probe loading performance is 0.17 pF, 50 kΩ differentially. Keysight noted that the extremely low input capacitance of the MX0100A minimizes the probe loading effect and maximizes signal integrity when measuring high-speed signals.
“Existing oscilloscope probe head solutions available today are even larger than the devices being tested in some cases. This makes signal probing access a continual challenge for modern electronic technologies,” said Dave Cipriani, Vice President of the Digital and Photonics Center of Excellence at Keysight Technologies.
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